The company provides services in making PCB layouts of any levels of complexity with ball grid array (BGA) components.
Within the terms of the service of PCB development we provide the following:

• Design various types of PCB:
  • Analog, digital, high-frequency
  • Single-sided and double-sided printed-circuit-boards
  • Multilayer printed circuit boards with BGA-packages, with blind and buried vias
• Construction 3D models
• Analysis of signal integrity (SI)
• Analysis of electromagnetic compatibility (EMC)
• Thermal modeling
• Assistance in maintaining PCB manufacture and mounting

PCB Layout Design
Process of PCB design is done in several stages. During the design cycle, we take into account DFT and DFM requirements and analyze device’s thermal operating mode.

Data Specifications
To start working on a PCB design we require from the customer minimal initial data in the form of electric circuit scheme, the list of elements and requirements specifications.
Creation of component library

Preliminary configuration
We arrange the components according to the requirements, fix components with rigid arrangement. According to the possibilities/requirements we can make a proposal for changing PCB dimensions. At this stage we can provide the client with a 3D model for conforming design requirements by dimensions and mounting parameters.

Layout
We perform final placement of elements, optimize connections, set traces parameters and layout rules, define number of layers and perform trace routing (wiring). If required, we can calculate characteristic and differential impedance by using special-purpose utilities. If necessary, we can model transient phenomena in circuits, analyze signal integrity, electromagnetic compatibility (EMC), thermal modes.

Design and modeling environments
Our specialists have skills in using the following packages and environments:

• Mentor Graphics VB2000, WG2002-2005
• CADENCE.SPB 15.7 (OrCAD, Allegro)
• PCAD 200x
• MDT (AutoCAD)
• Signal Vision and Signal Analyzer
• HyperLynx